A modular test structure for CMOS mismatch characterization

نویسندگان

  • Massimo Conti
  • Paolo Crippa
  • Francesco Fedecostunte
  • Simone Orcioni
  • F. Ricciardi
  • Claudio Turchetti
  • Loris Vendrame
چکیده

In this work a new test structure for mismatch characterization of CMOS technologies is presented. The test structure is modular, with a reduced area and it can be inserted in the space between the dies (scribe lines) on the wafers. The test structure has been implemented in a standard 0.18-μm digital CMOS technology.

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تاریخ انتشار 2003